Alseye T9+ Platinum 5g CPU Cooling Thermal Paste Kit

FEATURES:

T9+ Platinum Thermal Grease Kit
Alseye T9+ Platinum,

for your high-end gaming devices !!!

Non-curing materials
High thermal conductivity
Able to achieve very thin bond line thickness
Low thermal resistance
Thixotropic, low slump
Low volatile
 90% of the CPU temperature increase is due to the loss of thermal paste performance, not because of the heatsink dust or cooling fan performance degradation.

Outstanding Thermal Management

T9+ Platinum is formulated with thermally conductive filler particles and optimized silicone polymers to inprove the performance and reliability. 

T9+ Platinum Thermal Conductivity

Conductive filler particles and optimized silicone polymers create an uninterrupted, thermally-conductive path between CPU & heatsink.

Long-term Material Stability

T9+ Platinum stays strong over the full operating cycle of your gaming hardware, exhibiting minimal evaporation over a wide operating temperature range----even in a vacuum atmosphere (10-5 tor/mil, 24hrs@100℃).

Alseye T9+ Platinum

For top builds and high-end setups

Offering high thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond line thickness of approximately 18 um,

Thermally Conductive Compound yields low thermal resistance of 0.038℃-cm²/ W

SPECIFICATION:

Model    T9+ Platinum Kit
Color    Gray
MAIN
Electrical Conductivity    No
Volume    5g
One Part Material    Non-curing
Viscosity at Low Strain Rate    1,200 Pa-s
Viscosity at High Strain Rate    100 Pa-s
Specific Gravity    2.6
Volatile Content, 48 hours at 125°C    0.02%
Thermal Conductivity    13.5W/m-K
Thermal Resistance at 25 N/cm²    0.04 ℃-cm²/ W
Bond Line Thickness at 25 N/cm²    0.02 mm (0.0008 in)
Packing List    T9 + Platinum Edition Thermal Grease Shovel Brush Cleaner Finger Sleeve Wipe Cloth Fan Bearing Oil